6146:TYO
Disco Corp
Â¥47,470.00
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+0.21%(+100.00) 1D
Nov 13, 3:30:00 PM GMT+9 · JPY
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Open
Â¥49,100
High
Â¥49,240
Low
Â¥47,200
Mkt. cap
5.15T
Avg. vol.
2.25M
Volume
1.79M
Dividend
1.18%
Quarterly dividend
Â¥140
Ex-dividend date
Sep 29, 2026
P/E ratio
32.28
52-wk high
Â¥91,680
52-wk low
Â¥37,150
EPS
Â¥1,471
Shares outstanding
35.93M
No. of employees
6K
Open
Â¥49,100
High
Â¥49,240
Low
Â¥47,200
Mkt. cap
5.15T
Avg. vol.
2.25M
Volume
1.79M
Dividend
1.18%
Quarterly dividend
Â¥140
Ex-dividend date
Sep 29, 2026
P/E ratio
32.28
52-wk high
Â¥91,680
52-wk low
Â¥37,150
EPS
Â¥1,471
Shares outstanding
35.93M
No. of employees
6K
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Profile
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
About Disco Corp
CEOKazuma Sekiya
Employees5.55K
FoundedMay 5, 1937
Headquarters-
SectorInformation Technology
IndustrySemiconductor
Websitedisco.co.jp